Tags archives: camera-bump

With the advancement of technology, everything is getting compact, sleek and stylish. Β From the old generation room-sized computers to the portable and slim notebooks the electronics and communications are getting flexible and slender. Working on the same token, the engineers of Germany’s Fraunhofer institute developed a camera module which can be placated inside the chassis without forcing the need of camera bump. On Mobile World Congress 2017 in Barcelona on February 28, 2017, the Fraunhofer institute showed a prototype camera imag...